DeviceMed: Issue 2/24, Publishing Date 31.05.2024 (Trade fair issues for MedtecLIVE with T4M)
DeviceMed 002/2024
PD: 31.05.24
AC: 06.05.24
PPC: 13.05.24
Manufacturing: Robotics and automation, laser processing, labeling and packaging, quality assurance
Construction: sensors, optical components, laboratory technology
Management: regulations, IT and digitalization, sales and financing
PD: 31.05.24
AC: 06.05.24
PPC: 13.05.24
Print run: 11,000 copies - Trade fair issues for MedtecLIVE with T4M
The cover story is "Cybersecurity": Designing and managing secure medical devices in a digital world with artificial intelligence, big data analysis and the Internet of Things (IoT).
The trade fair special for MedtecLIVE with T4M provides an overview of the topics and trends as well as the exhibitors' products and services.
Manufacturing: Robotics and automation, laser processing, labeling and packaging, quality assurance
Construction: sensors, optical components, laboratory technology
Management: regulations, IT and digitalization, sales and financing
| Format | Please select a format, 1/1 page, junior page, 1/2 page, 1/3 page, 1/4 page, 1/8 page, insert: per 1,000 copies |
|---|---|
Producer |
Vogel Communications Group GmbH & Co. KG |