ELEKTRONIKPRAXIS: Dossier "Printed circuit board technology", Publishing Date 21.09.2026

Dossier "Printed circuit board technology"

Materials and substrates
Overview of PCB materials: FR4, flexible, Rogers, etc.
Properties, advantages and disadvantages of different substrates
New and sustainable materials in PCB production Design and layout of printed circuit boards
Basics of PCB design: from circuit to layout
Design software and tools: Current solutions and trends
Design for manufacturability (DFM) and design for testability (DFT) principles Manufacturing techniques and processes
Traditional vs. innovative manufacturing processes
Surface mount technology (SMT) and through-hole technology (THT)
Challenges and solutions in PCB prototyping Multilayer and high-frequency PCBs
Design and manufacturing of multilayer PCBs
High-frequency PCBs: Requirements and material selection
Signal integrity and impedance control Flexible and rigid-flex PCBs
Applications and benefits of flexible PCBs
Design challenges of rigid-flex PCBs
Future developments and market trends Thermal management in PCBs
Heat dissipation and cooling solutions
Impact of layout and material on thermal performance
Environmental aspects and recycling Sustainability in PCB manufacturing
Recycling processes andTesting and quality assurance
Test methods and equipment for PCBs
Automated optical inspection (AOI) and X-ray inspection Future trends and innovations
Impact of miniaturization on PCB design
Embedded components and system-in-package (SiP) technologies
3D printing and additive manufacturing processes for PCBs

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