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ELEKTRONIKPRAXIS: 007/2027 (May: Trade fair issues FPGA Congress)

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ELEKTRONIKPRAXIS 007/2027

Publishing Date: May 20 , 2027
Ad Close: April27 , 2027
Deadline for print materials: April30 , 2027

Special: FPGA
Expertise Newsletter on May 20, 2027
E-Paper Newsletter on May 24, 2027

Specials

  • Special: FPGA: Best Practices, Embedded Vision, Embedded AI, Signal Converters (D/A and A/D Converters), Architecture, Debugging & Verification, Tools & Methodologies

specialist topics

  • Avionics: Drones, Materials, Satellite Technology & Communications, Autonomous Systems, Propulsion Technology, Manufacturing
  • Electromechanics & Manufacturing: PCB assembly, equipment and services for assembly production, component placement, soldering technology, assembly testing, materials and surface treatment, EMS, 3D printers, connection technology
  • Photonics & Optoelectronics: Displays, e-paper, driver and control electronics, optical sensors, photodiodes, optical communication, LiFi, fiber optics, AR & VR technologies, standards & safety, photonic chips, laser technology, Lidar, time-of-flight
  • Quantum Computing: Quantum Communication, Quantum Imaging, Quantum AI, Quantum Sensing, Best Practices, Vacuum Systems, Cryogenics, Post-Quantum Cryptography, Applications
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