ELEKTRONIKPRAXIS: 009/2027 (June: Special Chiplets)

ELEKTRONIKPRAXIS 009/2027

Publishing Date: June 30 , 27
Ad Close: June9 , 27
Deadline for print materials: June14 , 27

Specials

• Special: Chiplets: Heterogeneous Integration, Advanced Packaging (2.5D Interposers, 3D Stacking), Hybrid Bonding, STCO, QMI, HBM, yield, package substrate, signal integrity, thermal management, standards, KGD strategy, mechanical and thermal warpage, shielding (interposer), interfaces, bus systems (UCIe), materials, design infrastructure, photonic chiplets
  

specialist topics

• Embedded Systems: Embedded Software Engineering, Real-Time Operating Systems, Embedded Linux, Software Development, Development Tools, Programming Languages, Edge AI, Tools, Programming Languages, Requirements Management, Functional Safety, Cryptography
  
• Semiconductors & IC Design: Analog and mixed-signal technology, digital circuits, RF technology, clock generators, signal and power integrity, data converters, microcontrollers, microprocessors, DSPs, ASICs, memory, SoCs, EMC concepts, wide-bandgap semiconductors (SiC, GaN)
  
• Power Design: Power Electronics, Power Supplies, Passive Components, Battery Technology, Energy Efficiency, Power Management, DC Grid, Grid Infrastructure, Power Semiconductors, Drive Electronics, Motor Controls, Control Engineering, Circuit Protection, Thermal Management
  
• Quantum Computing: Quantum Communication, Quantum Imaging, Quantum AI, Quantum Sensing, Best Practices, Vacuum Systems, Cryogenics, Post-Quantum Cryptography, Applications