ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024

ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
ELEKTRONIKPRAXIS: Issue 3/24, Publishing Date 07.03.2024
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  • Bound inserts: 4-sided
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  • Supplement: per 1,000 copies
ELEKTRONIKPRAXIS 003/2024
PD: 07.03.24
AC: 14.02.24
PPC: 20.02.24

Expertise Newsletter will be published on 07.03.2024

E-paper newsletter will be published on 11.03.2024



Electronics manufacturing & PCB technology: PCB assembly, equipment and service for module production, assembly, soldering technology, module testing, materials and surface technology, EMS, 3D printers
Power semiconductors & drive electronics: IGBTs, MOSFETs & modules for automotive, power management & motion control
Measuring, testing, checking: Oscilloscopes, analyzers, multimeters, measuring cards, software, test labs & EMC
Power supplies: Converters, power supply units & power supplies, batteries, UPS, power management, energy harvesting, photovoltaics
Thermal management: thermal design, simulation, heat dissipation, heat sinks, thermal interface materials (TIM), fans, heat pipes, liquid cooling
Format Please select a format, 2/1 page, 1/1 page, junior page, 1/2 page, 1/3 page, 1/4 page, 1/6 page, 1/8 page, bound-in inserts: 4-page, bound-in inserts: 6-page, bound-in inserts: 8-page, bound-in inserts: 2-page, inserts: per 1,000 copies

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Vogel Communications Group GmbH & Co. KG