ELEKTRONIKPRAXISDossier "Printed circuit board technology", Publishing Date 25.06.2024

Dossier "Printed circuit board technology"

Materials and substrates - Overview of PCB materials: FR4, flexible, Rogers, etc. - Properties, advantages and disadvantages of different substrates - New and sustainable materials in PCB production - Design and layout of printed circuit boards - Basics of PCB design: from circuit to layout - Design software and tools: Current solutions and trends - Design for manufacturability (DFM) and design for testability (DFT) principles Manufacturing techniques and processes - Traditional vs. innovative manufacturing processes - Surface mount technology (SMT) and through-hole technology (THT) - Challenges and solutions in PCB prototyping Multilayer and high-frequency PCBs - Design and manufacturing of multilayer PCBs - High-frequency PCBs: Requirements and material selection - Signal integrity and impedance control Flexible and rigid-flex PCBs - Applications and benefits of flexible PCBs - Design challenges in rigid-flex PCBs - Future developments and market trends Thermal management in PCBs - Heat dissipation and cooling solutions - Impact of layout and material on thermal performance - Environmental aspects and recycling Sustainability in PCB manufacturing - Recycling processes and -.Testing and quality assurance - Test methods and equipment for PCBs - Automated optical inspection (AOI) and X-ray inspection Future trends and innovations - Impact of miniaturization on PCB design - Embedded components and system-in-package (SiP) technologies - 3D printing and additive manufacturing processes for PCBs

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